Hotmeld-Moulding – enrichment for your product quality

By utilizing the Hotmelt-Molding procedure we are able to over-mold the circuit boards and plug connections in a material protecting way.

Assemblies are over-molded with low temperature and low processing pressure. Due to the complete embedding in casting compound, results in high quality and durable components, with low tool costs.

Examples of Application & Advantages:

  • Simple and economical housing solution
  • UL certified granulate material and the resulting UL-marking makes a worldwide market access possible for you
  • For simple and quick assembly: Injection of cable sleeves as strain relief and sleeve support
  • Sealing of existing plug connections
  • Protection against mechanical strain and moisture by over-molding plug connections

Naturally the used granulate material is adapted for the particular field of application and adjusted to your goals. Protection types up to IP67 can also be realized.

Working at Dommel